Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor...

on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Dicing saws may use a dicing blade...

dicing saw sales[citation needed]. In the past, cutting 1/2 to 2/3 of wafer thickness was the mainstream; with large diameter wafers on dicing tape,...

pieces diced from a single wafer. Individual dies are separated from a finished wafer in a process called die singulation, also called wafer dicing. The...

Andrew Dice Clay (born Andrew Clay Silverstein; September 29, 1957) is an American stand-up comedian and actor. He rose to prominence in the late 1980s...

during 'dicing', as the process of cutting the wafer is called. The picture on the right shows a 300 mm wafer after it was mounted and diced. The blue...

wafer metrology for ultra-thin patterned wafers mounted on grinding and dicing tapes" Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI...

wafer metrology for ultra-thin patterned wafers mounted on grinding and dicing tapes" Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI...

Madd Ladd – This Is My First Album (exec.) 1997: System of a Down - Demo Tape 3 1997: Various – Private Parts: The Album 1998: Slayer – Diabolus in Musica...

Black Dice & Wolf Eyes (2003) Chimes in Black Water 3 (2003) Leveer "Black Dice - Creature Comforts | Music Review | Tiny Mix Tapes", Tiny Mix Tapes, 2004...