The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices...
2 KB (263 words) - 18:42, 22 July 2023
Ion implantation Integrated injection logic Integrated passive devices Interconnect bottleneck Heat generation in integrated circuits High-temperature...
87 KB (9,261 words) - 08:32, 27 September 2024
concepts that describe the generation and conduction of heat in an integrated circuit, and presents numerical methods that model heat transfer from a macroscopic...
12 KB (2,063 words) - 17:38, 19 June 2024
Transistor computer (redirect from Second generation computer)
mainstream design into the late 1960s, when integrated circuits started appearing and led to the third-generation computer. The University of Manchester's...
14 KB (1,548 words) - 20:27, 25 August 2024
Thermal management (electronics) (redirect from Size vs. heat)
and improve thermal conditions in the equipment room. Heat generation in integrated circuits Thermal resistance in electronics Thermal management of...
30 KB (3,931 words) - 05:10, 31 July 2024
Digital electronics (redirect from Digital integrated circuit)
considerations. Digital electronic circuits are usually made from large assemblies of logic gates, often packaged in integrated circuits. Complex devices may have...
48 KB (6,096 words) - 16:41, 1 October 2024
engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic...
27 KB (3,430 words) - 09:00, 23 August 2024
of computers: the first generation utilized vacuum tubes; the second, transistors and diodes; the third, integrated circuits; and the fourth, microprocessors...
18 KB (2,302 words) - 22:57, 3 September 2024
Thermal design power (category Heat transfer)
the difference between TDP and SDP. Electronics portal Heat generation in integrated circuits Operating temperature Power rating Intel Turbo Boost AMD...
14 KB (1,412 words) - 15:09, 4 September 2024
to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect...
81 KB (8,773 words) - 07:39, 27 August 2024