third of all wire bonding machines in use will be set up for copper. Copper wire has become one of the preferred materials for wire bonding interconnects...

Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame...

wafer and attached to their carriers, typically via wire bonding such as thermosonic bonding. These wires eventually lead to pins on the outside of the carriers...

instead of wire for bonding. Thermocompression Bonding (TCB): The technique uses heat and pressure to create a bond between a thin wire (typically aluminum...

connections. In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded...

Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George...

tape-automated bonding are: All chip interconnections (inputs/outputs from/to the chip) are made during one bonding, and this differentiates TAB from the wire bonding...

method for creating electric interconnects: Ball bonding, a method very similar to wire bonding Chip bonding, a method of wiring some chips (also from different...

compounds. In microelectronics, these properties can cause problems in wire bonding. The main compounds formed are usually Au5Al2 (white plague) and AuAl2...

other electronic devices that require wire bonding. As a result of Coucoulas introducing thermosonic bonding lead wires in the early 1960s, its applications...