A wafer is a crisp, often sweet, very thin, flat, light biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. They...
7 KB (720 words) - 04:40, 22 August 2024
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for...
35 KB (3,752 words) - 13:33, 5 August 2024
Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed...
6 KB (854 words) - 22:37, 15 February 2024
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated...
2 KB (253 words) - 19:30, 1 January 2024
Semiconductor device fabrication (section Wafers)
of wafers from machine to machine. A wafer often has several integrated circuits which are called dies as they are pieces diced from a single wafer. Individual...
106 KB (11,201 words) - 22:23, 24 August 2024
Wafering is the process by which a silicon crystal (boule) is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple...
1 KB (153 words) - 04:51, 11 January 2019
Wacky Wafers are a candy sold by Leaf Brands, LLC. They are shaped about the size of an American half dollar coin and come in five flavors: banana, green...
2 KB (281 words) - 11:47, 17 January 2024
Necco Wafers are a sugar-based candy, sold in rolls of variously-flavored thin disks. First produced in 1847, they became the namesake and core product...
10 KB (1,014 words) - 17:05, 26 May 2024
Lam Research (section Wafer cleaning)
supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing...
20 KB (1,839 words) - 03:49, 20 August 2024
Die preparation (redirect from Wafer mounting)
which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing...
3 KB (366 words) - 00:20, 16 February 2024