In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical...
23 KB (3,277 words) - 19:33, 31 October 2024
DIP switch (redirect from Dual in-line package switch)
switch is a manual electric switch that is packaged with others in a group in a standard dual in-line package (DIP). The term may refer to each individual...
9 KB (1,066 words) - 15:36, 26 September 2024
axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s VLSI pin counts...
15 KB (1,597 words) - 00:08, 26 October 2024
PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP). The chip can be mounted either on the top or the...
10 KB (967 words) - 23:32, 3 September 2024
Small outline integrated circuit (redirect from Thin-shrink small-outline package)
surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness...
10 KB (1,015 words) - 16:08, 18 June 2024
surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness...
62 KB (3,396 words) - 21:48, 26 October 2024
DIMM (redirect from Dual in-line memory module)
A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and...
24 KB (2,113 words) - 04:04, 21 October 2024
LM386 (section Usage in guitar amplifiers)
amplifiers, and hobby electronics projects. The IC consists of an 8-pin dual in-line package (DIP-8) and can output 0.25 to 1 watts of power, depending on the...
5 KB (472 words) - 00:11, 1 October 2023
Transistor–transistor logic (section Packaging)
made in ceramic and plastic dual in-line package(s) and in flat-pack form. Some TTL chips are now also made in surface-mount technology packages. TTL...
31 KB (3,923 words) - 09:42, 26 September 2024
integrated circuit pin arrangement design Dual in-line package Greig, William J. (2007). Integrated circuit packaging, assembly and interconnections. Springer...
9 KB (1,158 words) - 17:07, 8 June 2024