• Thumbnail for Ball grid array
    A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount...
    17 KB (2,026 words) - 23:38, 25 July 2024
  • Thumbnail for Pin grid array
    A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular...
    10 KB (967 words) - 23:32, 3 September 2024
  • Thumbnail for Land grid array
    LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit...
    9 KB (1,272 words) - 10:30, 16 June 2024
  • Thumbnail for List of integrated circuit packaging types
    qualify these packages as CSPs is their ball pitch should be no more than 1 mm. Chip-scale package Ball grid array (BGA) uses the underside of the package...
    61 KB (3,391 words) - 00:31, 3 August 2024
  • Thumbnail for Zero insertion force
    devices of differing widths to be inserted. ZIF sockets can be used for ball grid array chips, particularly during development. These sockets tend to be unreliable...
    6 KB (822 words) - 08:40, 27 August 2024
  • Thumbnail for Integrated circuit packaging
    packages to land grid array (LGA) packages. Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages...
    15 KB (1,597 words) - 20:25, 22 April 2024
  • Thumbnail for Embedded wafer level ball grid array
    Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial...
    5 KB (656 words) - 16:32, 23 June 2024
  • Thumbnail for Solid-state drive
    Card) SSDs. In the early 2000s, a few companies introduced SSDs in Ball Grid Array (BGA) form factors, such as M-Systems' (now SanDisk) DiskOnChip and...
    124 KB (10,933 words) - 13:16, 20 October 2024
  • Thumbnail for Solder ball
    ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. The ball grid array...
    3 KB (266 words) - 21:32, 13 March 2023
  • Thumbnail for Array
    ICL Integrated circuit packages: Ball grid array pin grid array land grid array Processor array Programmable Array Logic (PAL), a systematic way to implement...
    4 KB (504 words) - 22:59, 23 July 2024