Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9...

Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices...

conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large...

were then packaged as the first "R" (red) series "Flip-Chip" modules. Later, other Flip-Chip module series provided additional speed, much higher logic...

its re-implementation using modern silicon transistors and the newer Flip-Chip module packaging to produce the PDP-10. The instruction sets of the two machines...

use wire wrap, as well as being the first to use the proprietary DEC Flip-Chip module which was invented in the same year. Feature also applies to concepts...

Equipment Corporation's Logic Handfbook Flip Chip™ Modules 1969 edition calls transparent RS latches as "R/S Flip Flops" (http://www.bitsavers...

device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization...

may be used on both the PCB and the package. Also, in stacked multi-chip modules, (package on package) solder balls are used to connect two packages....

for the PDP-4; DEC's first wire-wrapped machine using the associated Flip-Chip module form-factor. It was introduced in 1964, and a second version, the 7A...