Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9...
6 KB (640 words) - 23:46, 30 June 2024
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices...
15 KB (1,682 words) - 03:03, 22 June 2024
conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large...
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Digital Equipment Corporation (redirect from Digital Laboratory Module)
were then packaged as the first "R" (red) series "Flip-Chip" modules. Later, other Flip-Chip module series provided additional speed, much higher logic...
102 KB (12,412 words) - 23:53, 26 July 2024
its re-implementation using modern silicon transistors and the newer Flip-Chip module packaging to produce the PDP-10. The instruction sets of the two machines...
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use wire wrap, as well as being the first to use the proprietary DEC Flip-Chip module which was invented in the same year. Feature also applies to concepts...
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Equipment Corporation's Logic Handfbook Flip Chip™ Modules 1969 edition calls transparent RS latches as "R/S Flip Flops" (http://www.bitsavers...
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device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization...
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Ball grid array (category Chip carriers)
may be used on both the PCB and the package. Also, in stacked multi-chip modules, (package on package) solder balls are used to connect two packages....
17 KB (2,026 words) - 23:38, 25 July 2024
for the PDP-4; DEC's first wire-wrapped machine using the associated Flip-Chip module form-factor. It was introduced in 1964, and a second version, the 7A...
19 KB (2,367 words) - 10:47, 7 January 2024