A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on...

50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process. A sneak preview for RDNA 3 was included towards...

Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets. It is co-developed...

logic (processors) and memory in a single package, die stacking, several chiplets or dies in a package, combinations of these techniques, and others. 2.5D...

Haswell released in 2014, a shift to an multi-chip module (MCM) style "chiplet" package design, and a further shrink to Taiwan Semiconductor Manufacturing...

the first generation of Intel server and workstation processors to use a chiplet design. Sapphire Rapids is part of the Eagle Stream server platform. In...

showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more...

2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips...

multiply-accumulate (MMA) instructions First consumer graphics card to be based on a chiplet design TSMC N5 for Graphics Compute Die (GCD) TSMC N6 for Memory Cache...

2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Tim...