Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices...

Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9...

PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages...

are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and...

device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization...

An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...

LGA 7529 is an upcoming zero insertion force flip-chip land grid array (LGA) socket designed by Intel that will be used by the future Sierra Forest, a...

the "micro-FCBGA" (flip chip ball grid array) is Intel's current[when?] BGA mounting method for mobile processors that use a flip chip binding technology...

array, chip-scale package, and flip chip packages generally use solder balls. After the solder balls are used to attach an integrated circuit chip to a...

Equipment Corporation's Logic Handfbook Flip Chip™ Modules 1969 edition calls transparent RS latches as "R/S Flip Flops" (http://www.bitsavers...