Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices...
16 KB (1,762 words) - 17:06, 24 August 2024
Flip-Chip module A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9...
6 KB (640 words) - 23:46, 30 June 2024
Pin grid array (redirect from Flip-chip pin grid array)
PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side. Some PGA packages...
10 KB (967 words) - 23:32, 3 September 2024
are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and...
3 KB (370 words) - 22:06, 25 August 2023
device) with the conductive traces of the printed circuit board. In "flip chip on board", the device is inverted, with the top layer of metallization...
5 KB (743 words) - 07:55, 3 August 2024
Integrated circuit (redirect from Computer chip)
An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...
87 KB (9,261 words) - 18:01, 15 October 2024
Solder ball (section Usage in flip chip method)
array, chip-scale package, and flip chip packages generally use solder balls. After the solder balls are used to attach an integrated circuit chip to a...
3 KB (266 words) - 21:32, 13 March 2023
conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large...
12 KB (1,328 words) - 04:28, 31 July 2024
Equipment Corporation's Logic Handfbook Flip Chip™ Modules 1969 edition calls transparent RS latches as "R/S Flip Flops" (http://www.bitsavers...
56 KB (7,192 words) - 16:47, 4 October 2024
Ball grid array (category Chip carriers)
the "micro-FCBGA" (flip chip ball grid array) is Intel's current[when?] BGA mounting method for mobile processors that use a flip chip binding technology...
17 KB (2,026 words) - 23:38, 25 July 2024