• In digital electronics, the fan-out is the number of gate inputs driven by the output of another single logic gate. In most designs, logic gates are connected...
    9 KB (1,431 words) - 23:12, 7 September 2022
  • Fan-out has multiple meanings in software engineering. In message-oriented middleware solutions, fan-out is a messaging pattern used to model an information...
    3 KB (276 words) - 05:28, 26 March 2024
  • Thumbnail for Fan-out wafer-level packaging
    Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit...
    6 KB (554 words) - 21:31, 29 March 2024
  • Reconvergent fan-out is a technique to make VLSI logic simulation less pessimistic. Static timing analysis tries to figure out the best and worst case...
    2 KB (246 words) - 14:25, 14 January 2017
  • Thumbnail for Digital electronics
    cooler, and used less power, but had a very low fan-out of 3. Diode–transistor logic improved the fan-out up to about 7, and reduced the power. Some DTL...
    48 KB (6,089 words) - 03:33, 10 October 2024
  • Thumbnail for Alluvial fan
    proximal fan or fanhead) and becoming less steep further out (the medial fan or midfan) and shallowing at the edges of the fan (the distal fan or outer fan)....
    40 KB (5,069 words) - 03:21, 7 August 2024
  • Thumbnail for FanFan
    Christine Fan (born March 18, 1976), better known by her stage name FanFan or her Mandarin name Fan Wei-chi, is a Taiwanese-American singer-songwriter...
    13 KB (620 words) - 03:14, 21 August 2024
  • Fan-out, a related concept, which is the number of inputs that a given logic output drives. "fan-in and fan-out". Intel. Retrieved 2021-11-12. Fan-in...
    3 KB (346 words) - 16:30, 28 January 2024
  • Fan of a Fan: The Album is a collaborative album by American singer Chris Brown and American rapper Tyga, billed together as Chris Brown X Tyga and was...
    25 KB (1,837 words) - 22:40, 11 October 2024
  • Thumbnail for ASE Group
    Fan-out wafer-level packaging (FO-WLP), a process that enables ultra-thin, high-density packages, has been around for several years, and the fan-out technology...
    12 KB (1,326 words) - 11:01, 2 August 2024