enclosure. When selecting a depaneling technique, it is important to be mindful of the risks, including: Mechanical strain: depaneling can be a violent operation...
6 KB (896 words) - 16:36, 27 July 2024
Printed circuit board (section Depaneling)
individual boards is 2–3 mm. Today depaneling is often done by lasers which cut the board with no contact. Laser depaneling reduces stress on the fragile circuits...
85 KB (10,823 words) - 02:48, 18 August 2024
surface finishes or early failures due to excessive board flexure from depaneling or In-circuit test (ICT). Failure of electronic components Ball grid array...
5 KB (489 words) - 00:40, 18 February 2024
mechanical shock or board flexure due to In-circuit test (ICT), board depaneling, or connector insertion. However, pad cratering has also been known to...
8 KB (1,128 words) - 23:36, 4 July 2023