enclosure. When selecting a depaneling technique, it is important to be mindful of the risks, including: Mechanical strain: depaneling can be a violent operation...

individual boards is 2–3 mm. Today depaneling is often done by lasers which cut the board with no contact. Laser depaneling reduces stress on the fragile circuits...

surface finishes or early failures due to excessive board flexure from depaneling or In-circuit test (ICT). Failure of electronic components Ball grid array...

mechanical shock or board flexure due to In-circuit test (ICT), board depaneling, or connector insertion. However, pad cratering has also been known to...