• Thumbnail for Quad flat package
    A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such...
    9 KB (1,158 words) - 17:07, 8 June 2024
  • Thumbnail for Flat no-leads package
    Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed...
    15 KB (1,874 words) - 00:12, 28 March 2024
  • Thumbnail for List of integrated circuit packaging types
    flat-pack (MQFP): a QFP package with metric pin distribution Thin quad flat-pack (TQFP), a thinner version of LQFP Quad flat no-lead (QFN): smaller footprint...
    62 KB (3,395 words) - 11:34, 4 July 2024
  • Thumbnail for Desoldering
    head, and nozzles and fitting specific to particular component packages. Quad Flat Package (QFP) chips have thin leads closely packed together protruding...
    12 KB (1,799 words) - 21:21, 30 April 2024
  • format Quad Flat Package, a type of package for surface mounted integrated circuit Star quad cable, four insulated conductors twisted together Quad (unit)...
    3 KB (494 words) - 20:23, 1 April 2024
  • Thumbnail for Lead (electronics)
    mount packages with leads – such as Small Outline Integrated Circuit Quad Flat Package  – and for through-hole packages such as dual in-line package  – and...
    4 KB (487 words) - 10:33, 7 April 2024
  • Thumbnail for Zilog Z8
    in-line package (PDIP), Quad Flat No-leads package (MicroLeadFrame, MLF), small outline integrated circuit (SOIC), Shrink Small-Outline Package (SSOP)...
    4 KB (545 words) - 16:46, 5 August 2023
  • Thumbnail for Lead frame
    frames are used to manufacture a quad flat no-leads package (QFN), a quad flat package (QFP), or a dual in-line package (DIP). Advances in lead frame technology...
    4 KB (436 words) - 03:42, 1 March 2024
  • Thumbnail for Flatpack (electronics)
    surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to...
    3 KB (316 words) - 21:53, 8 January 2024
  • Thumbnail for U80701
    Erfurt (MME) in NMOS technology and is encased in a ceramic quad flat package (CQFP-68 package). The U80701 was developed by reverse engineering the MicroVAX...
    2 KB (187 words) - 13:14, 4 October 2023